A) a thin layer of Ag is formed on Cu
B) more voltage is required
C) \[A{{g}^{+}}\] ions are completely removed from solution
D) less availability of \[A{{g}^{+}}\] ions, as Cu cannot displace Ag from \[{{[Ag{{(CN)}_{2}}]}^{-}}\] ion.
Correct Answer: D
Solution :
[d] In silver plating \[K[Ag{{(CN)}_{2}}]\] is used which provides constant and required supply of \[A{{g}^{+}}\] ions as \[Ag{{(CN)}_{2}}^{-}\] is very stable. But if \[AgN{{O}_{3}}\] is used concentration of \[[A{{g}^{+}}]\] in solution will be very large. In that case Ag will be deposited at faster rate without any uniformity.You need to login to perform this action.
You will be redirected in
3 sec